This can be done en-masse with the Property Assignment tool or, more easily, with Design Explorer in search mode. A new property ASSEM_NO_MARK can be added to any component to suppress the pin 1 marker. Also called the minimum solder mask sliver or green oil bridge this lets you set a minimum feature width for the solder dam between pads.Īssembly Drawings Output: The assembly drawing output has been tweaked to include a BGA marker beside ball A1.
New Manufacturing Rule: A new manufacturing rule (defaulted off) for minimum solder dam.
It can be applied globally at the end of the design process and gated on the width of the track.Īlign and Distribute Commands: The recently added align command has been complemented by a distribute command, making it easy to quickly arrange rows of placed passives. from normal to neck style) to avoid sudden changes in track widths. Track Tapers / Teardrops: You can apply tapers to changes in track widths (E.g. This is the first of several planned phases of route placement/editing development now underway. Manual Route Editing – Preserving 45 Corners: The manual route editing algorithms have been improved to better maintain 45 degree cornering during route editing operations. Filled vias are exported in a separate drill file and marked as IPC-4761 type VII (filled and capped) in the Gerber X2 output. BGA) and invoke the via filling command from the right click context menu. Simply drag a selection box around the area (e.g. Resin Filled Via Support (NCVF): There is now support for resin filled vias, typically used with via-in-pad. This ensures that the uncoupled distance is minimised while also cornering in at 45 degrees, rather than at right angles.
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